Specially designed for low-residue, low-temperature resins.
E Grade has a low-residue formulation, and purges most commodity and engineering resins within the processing temperature range.
May be used in conjunction with other purging compound grades.
Whenever low residue is crucial, E Grade makes an excellent chaser to any other Asaclean® scrubbing grades' to ensure maximum cleaning with minimum residue.
|160°C to 300°C (320°F to 570°F)
|No minimum hot runner gate clearance requirement nor extrusion die or mesh clearance requirement.
|Amount of Purge
|Typically 1-2 system capacities (actual amount depends on degree of contamination)
|Injection Molding - including hot runners
Extrusion - profile, sheet & cast film
|Types of Resin
|Most commodity & engineering resins within the processing temperature range, particularly clear and low-temperature resins
- For maximum performance, Asaclean® E Grade should not be diluted with other materials.
- Asaclean® E Grade does not work by chemical reaction, so there is no soak time or hold-up time required for an effective purge.
- Asaclean® E Grade works best with maximum agitation - use the maximum safe screw speed and, for thermoplastic injection molding, also use maximum safe back pressure with the screw in the most forward position.
|Milky white - light yellow
|Other Solvent Solubility
|Soluble in methyl ethyl ketone, cyclohexanone, etc. (except inorganic content)
|Stable under normal temperatures
|Non-reactive under normal handling and storage conditions
|Conditions to Avoid
|Do not exceed recommended temperature range.
Do not allow Asaclean® E Grade to reside in barrel for more than 30 minutes at temperatures higher than 280°C (535°F).
|1.06 at 23°C (73°F)
Please Note: The above data should be used for reference only.